At Embedded World 2026 we caught up with Greg Sheridan, Vice President of Strategy & Product at Octavo Systems, as part of our promotional coverage for the event.

He asks: What if your processor, memory, and power were already solved – before you even start your design?

In the interview, Greg also explains how System-in-Package (SiP) technology is transforming embedded development. By integrating processors from Texas Instruments, STMicroelectronics, and AMD with DDR memory, power management, and hundreds of passives and other components into a single IC, Octavo eliminates the most time-consuming and risk-prone parts of hardware design, he tells us.

Thank you to Greg for his time.

Read the full Electronics Weekly news roundup from Embedded World 2026 »

Video: emap – Connor Moody