A technology that boosts condensation heat transfer performance by up to 5.5 times that of conventional copper surfaces has been developed by helping water droplets form more readily and detach more quickly. It is expected to improve the energy efficiency of power plants and desalination facilities and enhance the cooling performance of electronic devices.
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| # | Наименование новости | Тональность | Информативность | Дата публикации |
|---|---|---|---|---|
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