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Спутники
РН
SpaceX
Роскосмос
NASA
СпутникиРНSpaceXРоскосмосNASAPublication date: 13 April 2026
Source: Applied Mechanics and Materials Vol. 935
Author(s): Glenn Carlo Miranda
Emerging designs of devices require sophisticated bond pad architecture to meet certain specifications, design applications, as well as package requirements. Sophisticated bond pad structures often have thin metal layers and POA circuit bond pads underneath which require careful application of wire bond processing to avoid cracking on the bonding pads during wire bond. Bond pad crack is one of the most detrimental issues at wire bonding, especially with POA devices, so it is important to take into consideration the wire material to be used, the process parameter to be defined, as well as the structure of the bonding pad. This paper aims to resolve and eliminate the bond pad crack by the application Initial Force via Force Profiling, whilst adhering to the output response criteria at wire bond, and not going outside the defined process parameter window. Furthermore, this paper aims to help readers to have a more comprehensive understanding of the Force parameters at wire bond, as well as the different architecture of bonding pads.
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