Вход на сайт

Просмотр новости

Найдите то, что Вас интересует

PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements

Дата публикации: 12-02-2025 21:09:36

JEP30-K100B2026-08-07 00:00:00This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, supply chain, assembly process classification, design kit, generated ECAD models, product substrate and assemblies, qualification data, and environment including material declaration that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “Design Kit” subsection of the Part Model.
For more information visit the main JEP30 webpage.
Committees: JC-11JC-11.2JC-14

Основное содержимое страницы с новостью.

Please enable cookies.

Sorry, you have been blocked You are unable to access jedec.org
Why have I been blocked?

This website is using a security service to protect itself from online attacks. The action you just performed triggered the security solution. There are several actions that could trigger this block including submitting a certain word or phrase, a SQL command or malformed data.

What can I do to resolve this?

You can email the site owner to let them know you were blocked. Please include what you were doing when this page came up and the Cloudflare Ray ID found at the bottom of this page.

Cloudflare Ray ID: a2b5f8643bcf6f97 Your IP: 45.147.101.248 Performance & security by Cloudflare

Схожие новости

#Наименование новостиТональностьИнформативностьДата публикации
1PartModel Electrical Guidelines for Electronic-Device Packages – XML Requirements017.4609-03-2023
2PartModel Guidelines for Electronic-Device Packages – XML Requirements021.3309-03-2023
3PartModel SupplyChain Guidelines for Electronic-Device Packages – XML Requirements017.4609-03-2023
4PartModel Generated ECAD Models -Guidelines for Electronic-Device Packages – XML Requirements016.8312-02-2025
5Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements016.5109-03-2023
6PartModel Product Guidelines for Electronic-Device Substrates and Assemblies – XML Requirements016.5130-09-2025
7PartModel QualificationData -Guidelines for Electronic-Device Packages – XML Requirements017.7807-08-2026
8PART MODEL SCHEMAS016.4914-05-2024
9Stress Test Driven Qualification of Integrated Circuits029.0820-03-2009
10Foundry Process Qualification Guidelines – Technology Qualification Vehicle Testing033.0317-09-2018

Классификация: . Схожих патентов: 0. Схожих новостей: 10. Тональность: 0. Информативность: 17.14. Источник: www.jedec.org.