JEP30-K100B2026-08-07 00:00:00This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, supply chain, assembly process classification, design kit, generated ECAD models, product substrate and assemblies, qualification data, and environment including material declaration that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “Design Kit” subsection of the Part Model.
For more information visit the main JEP30 webpage.
Committees: JC-11JC-11.2JC-14
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| # | Наименование новости | Тональность | Информативность | Дата публикации |
|---|---|---|---|---|
| 1 | PartModel Electrical Guidelines for Electronic-Device Packages – XML Requirements | 0 | 17.46 | 09-03-2023 |
| 2 | PartModel Guidelines for Electronic-Device Packages – XML Requirements | 0 | 21.33 | 09-03-2023 |
| 3 | PartModel SupplyChain Guidelines for Electronic-Device Packages – XML Requirements | 0 | 17.46 | 09-03-2023 |
| 4 | PartModel Generated ECAD Models -Guidelines for Electronic-Device Packages – XML Requirements | 0 | 16.83 | 12-02-2025 |
| 5 | Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements | 0 | 16.51 | 09-03-2023 |
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| 7 | PartModel QualificationData -Guidelines for Electronic-Device Packages – XML Requirements | 0 | 17.78 | 07-08-2026 |
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